Silicon Photonics will revolutionize optical communication
Traditionally transceivers are built with optical subassemblies containing multiple components made of materials that are often expensive to purchase and challenging to process. Also these components need to be individually packaged and then repackaged into an hermetically sealed optical assembly.
In Silicon Photonics this optical subassembly is replaced by an optical chip. On this chip all components of a traditional subassembly are replaced by structures in silicon. This chip can then be fabricated just like an electronic chip enabling low cost high volume manufacturing.
The precision of the manufacturing process of optical chips in Silicon Photonics allows for huge miniaturization making it possible to develop transceivers that enable higher port density in optical networking equipment and consume less power than traditional transceivers.More about silicon photonics
Imec partners with Huawei on high-bandwidth optical data link technology
Ghent, Belgium, 3 December 2014 - Nanoelectronics research centre imec and global ICT leader Huawei announced today that they have taken a further step in their strategic partnership focusing on optical data link technology. The joint research on silicon-based optical interconnects...Read more
Huawei completes acquisition of Caliopa
9 September 2013. Huawei announced its continued investment expansion into Europe today through its acquisition of Caliopa from Baekeland, Fidimec, Ghent University, PMV, and other individual shareholders. The deal, which was supported by Woodside Capital Partners, opens the door...Read more